· -Superior ceramic strength by production with the new bonding method
· Superior removal capacity of hole-plugging ink
· Possible to form uniform surface
· Removal of hole plugging ink of PCB circuit board
· Precision grinding of surface following copper plating
· Leveling build-up product grinding
· Removal of bur and other dust
· Precision grinding of other large surface
| Mineral Type | Model No. | Grit | Remark | 
|---|---|---|---|
| Green Silicon Carbide | TS 02-A-S00 | #400 | Standard | 
| TS 03-A-S00 | #600 | ||
| TS 04-A-S00 | #800 | ||
| TS 05-A-S00 | #1200 | Special | |
| TS 20-A-S00 | #2000 | 
L1 : 710 ~ 610
L2 : Various dimensions possible

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